The Packaging Machinery Manufacturers Institute (PMMI), the leading global packaging industry resource and trade association, announced that University of Illinois at Urbana-Champaign (UIUC), located in Urbana, IL, has named student recipients of its 2007 PACK EXPO Scholarship. UIUC was one of 19 schools with a packaging curriculum that received scholarship funds from PMMI's PACK EXPO Scholarship program. Scholarship recipients were recognized at PACK EXPO International in Chicago, Illinois in October 2006.
University of Illinois at Urbana- Champaign was awarded $9500 in PACK EXPO Scholarship Funds.
The following students will receive a PACK EXPO Scholarship to support their packaging education:
Wednesday, May 16, 2007
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